This is a multi-part message in MIME format. ------=_NextPart_000_00A1_01BFECD5.708AFF90 Content-Type: text/plain; charset="iso-8859-1" Content-Transfer-Encoding: 7bit Hi, I think about building my first wearable computer (in standard techniques as described on different web sites) as a basis for a miniaturization project - which I think is necessary to get the wearables accepted. I have the possibility here at the insitute to realize a miniaturization of the modules by flip chip an chip on board technology (for those of the chips available without package). But I would need the design of the boards of the commonly used CPU and accessory modules to develop our layouts. Does anybody have an idea whether it is possible to get those? And which configuration do you think is best suited at the moment to build a much smaller computer - if this can be determied at all? I also see the wires as a problem. Has anybody tried bluetooth or DECT to connect the HMD, the keyboard and the computer? Thanks! Regards, Christine Kallmayer *************************************************************+ Christine Kallmayer Dept. Chip Interconnection Technologies Fraunhofer IZM Gustav-Meyer-Allee 25 13355 Berlin ------=_NextPart_000_00A1_01BFECD5.708AFF90 Content-Type: text/x-vcard; name="Christine Kallmayer.vcf" Content-Transfer-Encoding: quoted-printable Content-Disposition: attachment; filename="Christine Kallmayer.vcf" BEGIN:VCARD VERSION:2.1 N:Kallmayer;Christine;;Frau FN:Christine Kallmayer TEL;WORK;VOICE:+49 (30) 46403 228 TEL;CELL;VOICE:+49 (173) 9460719 TEL;WORK;FAX:+49 (30) 46403 161 ADR;WORK:;;Gustav-Meyer-Allee 25;Berlin;;13355;Deutschland LABEL;WORK;ENCODING=3DQUOTED-PRINTABLE:Gustav-Meyer-Allee = 25=3D0D=3D0ABerlin 13355=3D0D=3D0ADeutschland URL: URL:http://www.izm.fhg.de/avt/kallm.htm EMAIL;PREF;INTERNET:REV:20000703T063832Z END:VCARD ------=_NextPart_000_00A1_01BFECD5.708AFF90-- -- Subcription/unsubscription/info requests: send e-mail with subject of "subscribe", "unsubscribe", or "info" to
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