At 12:53 AM 11/30/98 -0600, Greg Teiber wrote: >Forget the '040......... the '060 is out :) And I don't see why it would be so difficult to just put stock traces and stock chips on a Large Hunk of Sillicon. Sorta like the 512k onboard wiht the PPro. I think the hardest part woudl be lowereing the power consumption of the '040-'060 series. They do requie Heatsinks, even at the 33mhz level. I guess it's time to start petitioning Motorolla :) Lotsa problems besides power consumption. 1) A very important consideration for full-fledged CPUs is the number of pins available. Every feature that you tack onto the chip is more pins that have to come out of the package. This causes more problems than you'd think. 2) The reason that the PPro never really took off was because it was *expensive*. The bigger your die size, the lower your dies-per-wafer, and the lower your yield (because larger dies have more room for mistakes). Doubling die size will cut dies-per-wafer by *more* than half (due to edge-of-wafer lossage), and will also roughly double your yield loss (which if you have high yield isn't so bad, but if you have low yield to begin with, you're hosed). 3) Concentration of heat. All that stuff you throw onto that single chip will be producing heat in one place, rather than being scattered around. This will aggravate heat problems. -- Subcription/unsubscription/info requests: send e-mail with subject of "subscribe", "unsubscribe", or "info" toWear-Hard Mailing List Archive (searchable): http://wearables.ml.org
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